Xin Henghui(301678.SZ): Plans to subscribe for an additional registered capital of 100 million yuan in Rongxin Semiconductor

Gelonghui April 1丨Newhenghui (301678.SZ) announced that the company plans to subscribe for an additional registered capital of RMB 3.22M in Rongxin Semiconductor (Ningbo) Co., Ltd. (the “target company,” “underlying company,” or “Rongxin Semiconductor”) for a consideration of RMB 100 million. Based on the total size of this round of capital increase of RMB 4 billion, after completion of this transaction, the company will hold 0.5882% equity in the target company.

Rongxin Semiconductor was established in April 2021. It is a 12-inch integrated circuit wafer foundry enterprise that was among the first in China to adopt a market-oriented capital operation model. The company focuses on the distinctive process track of mature processes from 28 to 180 nanometers. Its principal business includes wafer foundry services for mixed-signal, analog, and logic integrated circuits. It particularly covers foundry services in distinctive process areas such as image sensors, analog chips, and mixed-signal chips, as well as the foundry business for edge-side logic chips and computing chips—such as compute-in-memory chips applied in AI-related fields. The company has successfully built or planned multiple core technology and process platforms. Its foundry products are used in a wide range of application scenarios, including AI computing and intelligent devices, industrial control, consumer electronics, digital home, mobile communications, automotive electronics, and more.