The sci-tech innovation bond market continues to be hot, with issuance scale exceeding 180 billion yuan within the year

Since the beginning of this year, the issuance scale of science and technology innovation bonds has grown significantly and remained active. They have become an important tool in the bond market for supporting technological innovation and advancing “tech finance.” Data shows that as of March 23, based on the listing date, a total of 212 science and technology innovation bonds have been issued this year, with an issuance scale of 181.186 billion yuan, representing year-on-year increases of 78% and 60%, respectively. (Securities Daily)

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