Broadcom said it built the SoC on its 3.5D eXtreme Dimension System in Package (XDSiP) platform, which was introduced in 2024.
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Broadcom Ships First 2nm Chip Ahead of Crucial Q1 Earnings
Broadcom said it built the SoC on its 3.5D eXtreme Dimension System in Package (XDSiP) platform, which was introduced in 2024.