Hong Kong Stock Market Movement | ASMPT(00522) rises over 5%. Morgan Stanley expects the company to raise its long-term total addressable market (TAM) outlook for TCB equipment.
Zhitong Finance APP has learned that ASMPT (00522) is up more than 5%. As of the time of writing, it increased by 5.53% to HKD 110.7, with a trading volume of HKD 89.4897 million.
On the news front, J.P. Morgan previously released a research report indicating that, based on strong capital expenditure trends in the advanced logic packaging sector and initial signs of improvement in the mainstream outsourced semiconductor assembly and test (OSAT) market, the bank has placed ASMPT on its positive catalyst watch list. Additionally, the bank has raised its earnings per share forecasts for the company for fiscal years 2026 and 2027 by 7% and 15%, respectively.
J.P. Morgan expects ASMPT to revise upward its long-term total addressable market (TAM) for thermocompression bonding (TCB) equipment and shows confidence in gaining more market share in this sector. The company will also provide more updates on progress in the high-bandwidth memory (HBM) thermocompression bonding market and pointed out that the capital expenditure environment in China and among mainstream outsourced semiconductor packaging and testing manufacturers is becoming more favorable.
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Hong Kong Stock Market Movement | ASMPT(00522) rises over 5%. Morgan Stanley expects the company to raise its long-term total addressable market (TAM) outlook for TCB equipment.
Zhitong Finance APP has learned that ASMPT (00522) is up more than 5%. As of the time of writing, it increased by 5.53% to HKD 110.7, with a trading volume of HKD 89.4897 million.
On the news front, J.P. Morgan previously released a research report indicating that, based on strong capital expenditure trends in the advanced logic packaging sector and initial signs of improvement in the mainstream outsourced semiconductor assembly and test (OSAT) market, the bank has placed ASMPT on its positive catalyst watch list. Additionally, the bank has raised its earnings per share forecasts for the company for fiscal years 2026 and 2027 by 7% and 15%, respectively.
J.P. Morgan expects ASMPT to revise upward its long-term total addressable market (TAM) for thermocompression bonding (TCB) equipment and shows confidence in gaining more market share in this sector. The company will also provide more updates on progress in the high-bandwidth memory (HBM) thermocompression bonding market and pointed out that the capital expenditure environment in China and among mainstream outsourced semiconductor packaging and testing manufacturers is becoming more favorable.