英伟达GTC大会即将召开,聚焦AI算力迭代

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PANews 3月18日消息,据金融界报道,美国当地时间3月17日至21日,英伟达即将举办全球AI界顶级峰会——GTC2025。届时,黄仁勋将发表主题演讲,锁定AI智能体、机器人技术以及加速运算的未来发展。此次大会聚焦AI算力迭代,将重点展示新一代Blackwell Ultra GPU和Vera Rubin超级芯片架构。据官方披露,大会将发布多项技术创新成果,包括新一代GB300和B300算力卡、CPO交换机及NVL288机柜方案。其中B300性能或较B200提升50%以上。 随着AI技术的快速发展,算力需求不断攀升。为了满足日益增长的算力需求,硬件设备不断迭代升级,这也为新材料领域带来了巨大的商机。特别是在AI算力迭代的过程中,对于高性能、高稳定性材料的需求日益迫切,PTFE(聚四氟乙烯)材料因高频传输性能优势成为核心创新点。据悉,英伟达新一代GB300 AI服务器及NVL72架构中,PTFE基多层 PCB(40 层以上)被用于正交背板设计,替代传统铜缆方案。预计2025年全球AI服务器对PTFE树脂需求量将突破1万吨,市场规模达百亿美元。

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