MediaTek secures a major order for Google’s 8th-generation TPU! “ASIC” market sentiment catches on, benefiting three concept stocks

semiconductor chip design giant MediaTek (2454) recently reportedly succeeded in entering Google’s 8th-generation TPU training chip supply chain. Not only does it participate in the core I/O Die (input/output chip) design, but it also adopted advanced process and high-end packaging technologies, symbolizing that it has officially entered the high-end AI ASIC battlefield. With shipping scale and demand heating up, Taiwan-based suppliers such as JYLEN ELECTRONICS (2449), Test Research (6510), and Hon Hai? (7769) are expected to see another wave of growth momentum.

(MediaTek’s stock price breaks through the 2,000-yuan mark with limit-up gains, as the earnings call countdown ignites the AI ASIC theme)

MediaTek moves into Google’s 8th-generation TPU training chip supply chain

Commercial Times reports that Google’s latest 8th-generation TPU architecture is divided into the TPU 8t for training and the TPU 8i for inference. Since the training chips need to support computations for large AI models, the technical threshold is significantly higher. Supply-chain vendors disclose that this time MediaTek has targeted TPU 8t, responsible for I/O Die design and integration services, showing that it already has design capabilities to support high-intensity AI training requirements.

In terms of process and packaging, this project uses TSMC N3P (3-nanometer enhanced process) combined with CoWoS-S advanced packaging solutions, further boosting chip performance and integration density. Industry analysts say that being able to enter such high-spec projects indicates that MediaTek’s technical capabilities have leaped up to the leading tier in AI chip design.

(Google Ironwood TPU: 10x performance + four partners take on Nvidia)

ASIC business becomes a new engine, and TPU shipment scale drives revenue growth

As cloud giants continue to ramp up AI infrastructure, demand for customized ASIC chips is rapidly heating up. In recent years, MediaTek has actively laid out its ASIC business and, thanks to advantages in high-speed interfaces and system integration, has successfully secured its position. The company expects that this year’s ASIC business revenue could exceed 1 billion USD, becoming one of the key growth drivers.

The market further points out that Google TPU wafer intake continues to be increased, with estimates that by 2027 the total shipment volume could reach the tens-of-millions-of-units scale. Whether orders are shared by MediaTek or other design houses, they will bring long-term, stable revenue contributions to the supply chain.

Test and equipment demand heats up, and three ASIC concept stocks benefit in sync

Because AI training chips adopt advanced processes and high-complexity packaging, requirements for test accuracy and rigor increase significantly, driving rapid growth in related supply-chain demand. The industry says that JYLEN ELECTRONICS and Test Research, which have been deeply focused on high-performance computing test, will directly benefit from rising AI chip testing needs.

At the same time, equipment maker Hon Hai? (Gains can also be expected to benefit from the trend of expanded equipment investment. As chip unit prices rise and test process upgrades proceed, system-level testing )SLT( is gradually becoming a standard process for high-end chips, further increasing the importance of test stages within the overall supply chain.

Competition shifts toward division of labor and collaboration: AI chips enter a new era of high-spec contests

Regarding competitive landscape, the market had previously paid attention to whether Marvell Technology )Marvell Technology( would enter the TPU supply chain, but so far no clear plans have emerged. Industry analysis suggests that as the difficulty of AI chip design continues to rise, future competition will shift from simply抢 orders to division of labor and collaboration, and even give rise to new business models such as “consign die )Consign die(.”

In the long run, AI chips will move toward chiplet )small chips and heterogeneous integration, increasing reliance on advanced packaging technologies, which in turn further pushes up TSMC’s capacity utilization and overall semiconductor industry technology thresholds.

Under this trend, MediaTek’s successful entry into Google’s training chip core not only represents its own transformation results, but also symbolizes the continued strengthening of Taiwan’s supply chain’s key position in global AI competition.

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