US Stock Insider Trading | Benchmark disclosed 1 insider transaction on February 11

On February 11, 2026, Benchmark (BHE) disclosed a insider transaction. Director Jeff Benck sold 25,000 shares on February 6, 2026.

[Recent Insider Transactions]

Disclosure Date Position Name Transaction Date Buy/Sell Quantity Price per Share/USD Total Amount/USD
February 11, 2026 Director Jeff Benck February 6, 2026 Sell 25,000 58.19 1,454,800
January 22, 2026 Director Jeff Benck January 21, 2026 Sell 14,900 50.24 748,600
January 22, 2026 Director Jeff Benck January 20, 2026 Sell 100 50.00 5,000
December 16, 2025 Executive Rhonda R. Turner December 12, 2025 Sell 10,000 47.83 478,300
December 9, 2025 Director Jeff Benck December 8, 2025 Sell 10,000 47.55 475,500
December 9, 2025 Executive Rhonda R. Turner December 5, 2025 Sell 10,000 46.90 469,000
December 9, 2025 Executive Stephen J. Beaver December 8, 2025 Sell 1,250 48.00 60,000
December 9, 2025 Executive Stephen J. Beaver December 5, 2025 Sell 8,750 46.92 410,600
November 20, 2025 Executive Jan M. Janick November 20, 2025 Sell 8,967 42.66 382,500
October 15, 2025 Executive Bryan Robert Schumaker October 14, 2025 Sell 2,204 37.77 83,200

[Company Profile]

Benchmark Electronics, Inc., formerly Electronics Inc., began operations in 1979 and was legally incorporated in Texas in 1981 as a wholly owned subsidiary of Intermedics Inc. Its parent company is a manufacturer of medical implants, headquartered in Angleton, Texas. Benchmark Electronics is a global provider of comprehensive electronic manufacturing services (EMS), serving original equipment manufacturers (OEMs) of computers and related products. (Relevant products may be used in commercial enterprises, medical devices, industrial control equipment, test and measurement instruments, and telecommunications equipment.) The services offered by the company are often referred to as EMS. From initial product design to mass production, the company provides comprehensive and integrated design and manufacturing services, including direct order fulfillment and post-deployment services. Its manufacturing and assembly operations include printed circuit board and subsystem assembly, complete machine assembly and system integration, subsystem integration processes, often downloading and integrating software to produce a fully configured product.

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